
A fabless semiconductor design center with real in-house expertise across the full chip design lifecycle, from architecture to physical design.
Front-end through back-end IC design outsourcing for international fabless customers. End-to-end ownership from Specs → Architecture → RTL → Verification → FPGA → GDSII → Bring-up → System, backed by senior silicon architects with 25-30+ years across global semiconductor leaders. Our focus areas include AI infrastructure and high-performance computing, backed by decades of global engineering experience driving real technology transfer into Vietnam.
Full RTL2GDSII ownership at advanced nodes: TSMC 16/12/5nm and Samsung 5/4nm. Synthesis, DFT, P&R, MMMC STA, SI/PI, IR-drop, DRC/LVS, parasitic extraction through GDSII foundry handoff. IP hardening for ARM, RISC-V, LPDDR, and 3rd-party IPs.
Verilog and SystemVerilog RTL coding, IP integration, and subsystem/SoC assembly. ARM & RISC-V control planes, custom AI/DSP accelerators, memory subsystems (DDR/LPDDR/HBM), and high-speed interconnects (PCIe, USB, MIPI, Ethernet).
SoC-level UVM verification with closed-loop Metric-Driven Verification (MDV), formal methods, and emulation-friendly flows. Proven first-silicon success across AI, automotive, communications, and storage SoCs.
Scale your R&D with managed offshore design centers (ODC). Flexible engagement: project-based, SoW, staff augmentation, or long-term ODC, with secure IP practices and transparent KPIs.
Porting existing IP and SoC designs to new process nodes or foundries. PDK migration, library re-characterization, flow re-tuning, and PPA recovery on advanced nodes.
Feasibility, prototyping, and validation on UltraScale+, Zynq, Virtex, and Kintex platforms. Multi-FPGA architectures, PCIe-based hostless designs, high-speed ADC/DAC (JESD204B/C), Linux and FreeRTOS bring-up.
Complex 12-16 layer PCBs combining RF, digital, and high-speed signaling. Board design, layout, bring-up, and embedded software for chip validation and customer dev kits.
PPA evaluation and hardening of 3rd-party IPs or internal blocks. Independent comparison of cores, memory controllers, and interconnect IPs, informed selection before SoC integration.
System and chip-level architectural exploration and feasibility. Workload-driven definition of compute, memory, interconnect, and I/O subsystems, defined before implementation begins.
Beyond services, QNSC is developing a proprietary chip portfolio targeting accessible categories where Vietnamese design talent can compete globally. Start with moderate-complexity products, accumulate IP, then expand.
Ultra-low-power SoC with integrated connectivity for smart edge devices.
Market: Smart home, agritech, asset tracking
General-purpose MCU for industrial control, home appliances, and entry-level automotive applications.
Market: Industrial control, home appliances
Security-certified chip for smart cards, eSIM, payment, and identity applications.
Market: Smart cards, eSIM, payment, identity

Quy Nhon is the administrative center of Vietnam's new Gia Lai province (post-2025 provincial merger), a coastal hub anchored by strong engineering universities, active provincial government support for the semiconductor industry, and an exceptional quality of life for engineers.
QNSC is built on a direct partnership with Quy Nhon University (QNU), one of the few Vietnamese universities offering an official semiconductor program, guaranteeing a sustained pipeline of trained junior engineers feeding our OJT Sub Team and long-term scale-up.
QNSC is led by Vietnamese founders with deep entrepreneurial and engineering experience, supported by an Executive Board Advisor and Strategic Advisors bringing 25-40+ years of leadership across global semiconductor and AI infrastructure companies: IBM, Meta, Intel, Samsung, TSMC, Arm, Synopsys, Qualcomm, Bosch, Ericsson.
Leadership

Vietnamese industrial entrepreneur and technology investor. Chairman & Co-Founder of QNSC and founder/chairman of multiple industrial companies across construction materials, mining, manufacturing, and Vietnam-Japan export ventures, including TAKUMINO Co. (JV with Japan's OKUNO Trading), My Quang JSC, and An Vien An Loc Phat Investment. Actively involved in semiconductor, AI, advanced manufacturing, and technology commercialization initiatives in Vietnam.
Founding CEO of QNSC. 15+ years of P&L leadership across large engineering organizations in the US, EU, and Asia-Pacific. Deep expertise in AI-augmented engineering management: shaping engineering strategy, aligning delivery with customer business outcomes, and integrating AI across the full engineering lifecycle at scale, directly applicable to modern AI-accelerated chip design flows.
Executive Board Advisor

Thao Nguyen is a Vietnamese-American technology entrepreneur with 40 years of leadership experience in semiconductor design, data center infrastructure, and large-scale system architecture. He began his career as a VLSI chip designer at IBM in 1985 and later played a key role at Facebook through the Open Compute Project, contributing to the design and deployment of millions of servers for hyperscale data centers worldwide. Today, he leads memory-centric AI infrastructure innovation as Founder & CEO of TORmem Inc. (USA).
As an overseas Vietnamese, Thao is passionate about helping Vietnam grow its high-tech and semiconductor industry by transferring real-world knowledge, engineering expertise, and global industry experience to the next generation of Vietnamese engineers and technology leaders.
Strategic Advisors & Experts




QNSC is building its workforce on two complementary tracks: experienced engineers driving delivery from day one, plus a Quy Nhon-based junior pipeline trained by senior silicon experts. The future scale engine of Vietnamese chip design.
We're hiring on both tracks: experienced engineers ready to deliver from day one, and new graduates ready to learn through our silicon expert-led OJT program.
Tell us about your design needs, partnership ideas, or career interest. We'll respond within 24 hours.